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HieFo Introduces Next Generation High Power Gain Chip for Integrated Tunable Laser Assembly (xITLA)
HieFo Introduces Next Generation High Power Gain Chip for Integrated Tunable Laser Assembly (xITLA) GlobeNewswire September 04, 2024 ALHAMBRA, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- The latest
GlobeNewswire
September 04, 2024
ALHAMBRA, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- The latest Highest Efficiency Gain Chip design addresses critical market demands for higher optical output power and lower electrical power consumption. HieFo’s HGC20 C+band Gain Chip sets a new performance benchmark as the fundamental building block for the next generation of Integrated tunable lasers (xITLA).
